IXYS Solid State Relay, 9.4 A rms Load, PCB Mount - CPC1988J

Brand: IXYS
The IXYS Solid State Relay provides 9.4A load current with PCB mounting, suitable for various applications.
Manufacturer part number: CPC1988J
Availability: In stock
€23.75 incl tax
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Only Ships to: France, Monaco, Italy
For shipping outside these regions, please contact customer support.
Maximum Load Current = 9.4 A rms
Mounting Type = PCB Mount
Switching Type = DC
Number of Poles = 1
Contact Configuration = SPST
Output Device = MOSFET
Package Style = ISO Plus-264
Maximum Turn On Time = 20ms
Dimensions = 19.914 x 5.029 x 26.162mm
Height = 26.2mm

UL 508 Certified Component: File E69938. 1-Form-A OptoMOS Power Relay, CPC. These single pole solid state relays have normally open (1-Form-A) contacts. They feature a unique ISOPLUS-264 package giving the highest possible load current and power ratings. They are able to provide 2500 Vrms of input to output isolation by utilising optically coupled MOSFET technology. The optically coupled outputs use the well-known OptoMOS architecture and are controlled by a highly efficient infrared LED. With a low on-resistance and a high load current rating these units are suitable for a wide variety of applications. The unique ISOPLUS-264 package is manufactured with the silicon chip being soft soldered onto the Direct Copper Bond (DCB) substrate rather than the traditional copper lead frame. These DCB ceramics are what makes it possible to provide 2500 Vrms isolation but still offer a very low junction-to-case thermal resistance from only 0.3C per watt. Potential Applications: Industrial controls/motor control Robotics Medical equipment: Patient/equipment isolation Instrumentation: Multiplexers, data acquisition, electronic switching and I/O subsystems Energy meters Transportation equipment Aerospace/defence. Features 2.25 Arms load current with 5°C per watt heat sink Low on-resistance Selection of blocking voltages 2500 Vrms input/output isolation Low thermal resistance Isolated, low thermal impedance ceramic pad for heat sink applications Low drive power requirements Arc-free with no snubbing circuits No EMI/RFI generation Machine insertable, wave solderable
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