Bergquist Heatsink Adhesive Tape for use with Heatsink - BP100-0.005-00-1112

Stock Number 477-4856 dimensions 150 x 140 x 0.127 mm Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm Stock Number 4774878 dimensions 25 x 25 x 0.127 mm. Bond-Ply 100. Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes. Uses include:. Mounting heatsink to BGA graphic processor Mounting heatsink onto computer processor Mounting heatsink onto drive processor