Wencon - Release Agent for Adhesion Prevention - 1110

Manufacturer: Wencon
Prevent adhesion with Wencon Release Agent, ideal for coatings and putties.
Manufacturer part number: 1110
Vendor: ConceptSRP
€12.58
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Wencon Release Agent

Wencon release agent is used in applications where you need to prevent adhesion between the Wencon repair compound, coating or putty and the substrate.

Products specifications
FeaturesWencon Release agent is used in applications where you need to prevent adhesion between the Wencon repair compound, Coating or Putty and the substrate.
Other included componentsInstructions, for use.
Detailed SpecificationsWencon Release Agent greasy cream which ensures that the compound or coating does not adhere, where it is not suppose to.
ColourTransparent